BGA Reballing (Lead Free / 63-37 / High Melt Ceramic Packages)
$1/2 million investment in a unique technology has allowed Retronix to reball BGA and uBGA devices without inducing a thermal cycle (mass reflow), which can damage the integrity of the device. We use a laser energy pulse which attaches the solder spheres individually to the pad in less than 20m/s. The bonding of the sphere to pad in this short time does not allow heat dissipation into the silicon die, therefore offering a safe alternative to mass reflow. The equipment shown is contained within a clean room environment, supplemented by laminar flow hoods and a nitrogen chamber for the reballing process. We can process sphere sizes from 760 microns down to 100 microns.

 

Mechanical Data Sheet	BGA Laser Reball Video Small (363k) Large (3.17Mb)